Suppliers
Companies
Browse prescreened suppliers by sector, stage, and verdict. Open any dossier for the full picture.
51 results
Amkor Technology
OSAT: advanced flip-chip, wire-bond, 2.5D/3D packaging, test
Aoi Electronics Co., Ltd. (アオイ電子)
OSAT — advanced fan-out laminate package (FOLP), legacy SOP/QFN/DFN, targeting global top-10 OSAT via Sharp plant acquisition
ASE Technology Holding (incl. SPIL)
OSAT: wire-bond, flip-chip, 2.5D/3D advanced packaging (VIPack), test
Carsem (Malaysian Pacific Industries / MPI)
OSAT: turnkey packaging and test, automotive/power/AI packages
CG Power and Industrial Solutions (OSAT)
OSAT: new-entrant assembly, packaging and test facility
China Wafer Level CSP (晶方科技)
Wafer-level chip-scale packaging (WLCSP) and test, esp. CMOS image sensors and sensors
Chipbond Technology Corporation
Display-driver IC packaging and gold-bumping/COF/COG assembly and test
ChipMOS Technologies
OSAT: display driver IC and memory packaging/test
CT Semiconductor
Semiconductor chip assembly, test and packaging (ATP)
Deca Technologies
Advanced fan-out wafer-level packaging (M-Series, Adaptive Patterning)
Globetronics Technology Bhd.
IC and optoelectronic device assembly/test, sensor and optical module assembly
Greatek Electronics
OSAT: mid-tier specialty packaging
Hana Micron
OSAT: memory and system semiconductor packaging
Hefei Chipmore Technology (Chipmore/颀中科技)
Display driver IC packaging and test (gold/copper bumping, wafer test, COF/COG flip-chip)
HuaCheng Technology (汇成股份)
Display driver IC full-process packaging/test (bumping, CP wafer test, COG, COF)
Inari Amertron Berhad
OSAT for RF, fiber-optic transceivers, optoelectronics, sensors and custom IC assembly/test (SiP)
Integra Technologies
US-based OSAT: advanced packaging and test for domestic supply-chain customers (aerospace/defense-adjacent)
Intel Foundry ASAT (Advanced System Assembly and Test)
Captive/merchant advanced packaging: EMIB, Foveros; largest assembly/test site network globally (Vietnam, Malaysia)
JCET Group
OSAT: wire-bond, flip-chip, advanced packaging, automotive
Kaynes Semicon Private Limited
OSAT: chip assembly, testing, marking and packaging; initial output Intelligent Power Modules (IPMs)
King Yuan Electronics (KYEC)
OSAT: test-focused services (wafer probing, final test)
LB Semicon Inc.
Bumping and packaging services, memory and non-memory IC test
Lingsen Precision Industries, Ltd.
IC packaging and testing; optoelectronic device assembly
Liyang Chip Testing / Guangdong Liyang Chip Testing (利扬芯片)
Independent third-party wafer and finished-chip test (down to 3-16nm nodes)
Micron Technology
IDM, DRAM and NAND memory
Nepes Corporation
OSAT: fan-out wafer-level and panel-level packaging (FOWLP/FOPLP), bumping
Oita Device Technology Co., Ltd. (ODT / 大分デバイステクノロジー)
OSAT specialized in power devices/modules — SiC/GaN power module packaging, design-through-volume-production
Orient Semiconductor Electronics (OSE)
OSAT: regional-scale packaging and test
Powertech Technology (PTI)
OSAT: memory packaging and testing
Presto Engineering
Semiconductor test services (EWS/final test), failure analysis, and OSAT partnership brokering for fabless customers
QP Technology (气派科技)
IC packaging and test: SOP, SOT, QFN/DFN, LQFP, DIP families (120+ package types)
Samsung Electronics (Samsung Foundry)
Foundry logic + IDM memory (DRAM, NAND)
SFA Semicon
OSAT: memory-focused packaging and test
Shinko Electric Industries
FC-BGA substrates, also leadframes
Signetics Korea
OSAT / System-in-Package packaging
Sigurd Microelectronics Corp.
Discrete and power semiconductor packaging and test
Sino IC Technology / Shanghai Huailing (华岭股份)
Independent third-party IC test: wafer test, finished-product test, system-level test, high-reliability test
SJ Semiconductor (SJSemi / 盛合晶微半导体)
Middle-end-of-line (MEOL) wafer bumping and advanced packaging: WLCSP, 2.5D/3D chiplet packaging
SPEL Semiconductor Limited
IC assembly and test: wafer sort, leaded and QFN packaging, drop-shipment
Tata Electronics
Foundry, logic (JV with PSMC)
Team Pacific Corporation (TPC)
OSAT specialized in power discrete packages (SOT-227, TO-247, TO-264), power modules, hermetically sealed metal cans; new SiC line for automotive
Texas Instruments (BMS ICs)
BMS (cell-level)| IDM, analog and embedded processing
Tianshui Huatian Technology (HT-Tech)
OSAT: wire-bond, flip-chip, advanced packaging
Tongfu Microelectronics (TFME)
OSAT: flip-chip, MCM, advanced packaging for AMD CPUs/GPUs
TSMC
Pure-play foundry, all logic nodes incl. leading-edge
Unisem Group
OSAT: wafer bumping, IC packaging, RF/mixed-signal test
UTAC Group (United Test and Assembly Center)
OSAT: leadframe, laminate, WLP, SiP for automotive/analog
Walton Advanced Engineering, Inc.
Memory IC assembly, burn-in, final test, MCP/SiP packaging
Wintest / Shanghai V-Test Semiconductor (伟测科技)
Independent third-party wafer test and finished-chip test services
YSemi (甬矽电子, Ningbo Forehope Electronic)
Mid-to-high-end IC packaging/test: QFN/DFN, WBLGA, FCBGA, Fan-in/Fan-out WLCSP, 2.5D/3D packaging