Company record
Chipbond Technology Corporation
Makes packaged chip · Taiwan
PassedCHIPS and export controls
Not incorporated in a country of concern, with no US government list entry and no owner from such a country in the screening record.
Not based in a covered nation and on no government list. About CHIPS
The check read Home country Owners US government lists
Legal name: 頎邦科技股份有限公司
Where it sits
Loading the model
Packaged chip
The Semiconductors chain, raw material to product
Products on record: Display-driver IC packaging and gold-bumping/COF/COG assembly and test
Owners
- Parent
- None on record
- Ownership
- Public
Locations
- Headquarters
- Hsinchu, Taiwan
- Production
- Hsinchu, Taiwan
Sources
- Company registries
- 1 matched
- Registry identifier
- 254900AK7VTHB4UYLR40
- Government lists
- None matched
Others making packaged chipTaiwan first
- ASE Technology Holding (incl. SPIL)Kaohsiung, TaiwanCHIPS: Passed
- ChipMOS TechnologiesHsinchu, TaiwanCHIPS: Needs review
- Greatek ElectronicsTaoyuan, TaiwanCHIPS: Passed
- King Yuan Electronics (KYEC)Hsinchu, TaiwanCHIPS: Passed
- Lingsen Precision Industries, Ltd.Taichung, TaiwanCHIPS: Needs review
- Orient Semiconductor Electronics (OSE)Kaohsiung, TaiwanCHIPS: Passed
- Powertech Technology (PTI)Hsinchu, TaiwanCHIPS: Passed
- Sigurd Microelectronics Corp.Taipei, TaiwanCHIPS: Needs review
Automated results come from registry sources, read by fixed rules, with research findings where the registries stop. The chip results also read the US government lists; for FEOC the lists are read in a full screen. They are advisory, not legal advice. The full report, every test with its sources, is on request. Contact us