Best on a bigger screen

The interactive map needs room. Open verdex.app on a laptop or desktop.

Company Dossier

Chipbond Technology Corporation

Hsinchu · Taiwan

All companies
Semiconductors · Assembly, Packaging & Test

Chipbond Technology Corporation

頎邦科技股份有限公司

Hsinchu · Taiwan

CLEAR

Chipbond Technology Corporation is a company in the semiconductors supply chain, operating in Assembly, Packaging & Test, based in Hsinchu, Taiwan. Verdex maps it across 1 stage of the supply chain, covering Display-driver IC packaging and gold-bumping/COF/COG assembly and test.

CHIPS / Export-Control Verdict
CLEAR

No covered-nation incorporation, no statutory-list membership, no covered-nation ownership signal in the screening record

Country
Taiwan
HQ City
Hsinchu
Sector
Semiconductors
Category
Assembly, Packaging & Test
Product Line
Display-driver IC packaging and gold-bumping/COF/COG assembly and test
Production Locations
Hsinchu Taiwan
LEI
254900AK7VTHB4UYLR40
Ownership Type
Public
Resolution
PARTIAL
Registries Matched
1
Data Quality
0.89

Supply chain placement

Semiconductors
Assembly, Packaging & Test

Need a deeper screen on this supplier?

Run the full export-control screen (ownership trace, statutory lists, control analysis), with audit trail.

Contact

Prescreen verdicts are deterministic ratings based on registry data (GLEIF, SEC EDGAR, OpenCorporates, Tianyancha) and statutory lists (CSL, OFAC, BIS, UFLPA, NDAA §154b). They are advisory, not legal advice.