Best on a bigger screen

The interactive map needs room. Open verdex.app on a laptop or desktop.

Company Dossier

Chipbond Technology Corporation

Hsinchu · Taiwan

All companies
Semiconductors · Assembly, Packaging & Test

Chipbond Technology Corporation

頎邦科技股份有限公司

Hsinchu · Taiwan

CLEAR

Chipbond Technology Corporation is a company in the semiconductors supply chain, operating in Assembly, Packaging & Test, based in Hsinchu, Taiwan. Its main product line is Display-driver IC packaging and gold-bumping/COF/COG assembly and test.

FEOC Prescreen Verdict
confidence: deterministic

Widely-held public entity — no concentrated holder signal from registry data

CHIPS / Export-Control Verdict
CLEAR

No covered-nation incorporation, no statutory-list membership, no covered-nation ownership signal in the screening record

Country
Taiwan
HQ City
Hsinchu
Sector
Semiconductors
Category
Assembly, Packaging & Test
Product Line
Display-driver IC packaging and gold-bumping/COF/COG assembly and test
Production Locations
Hsinchu Taiwan
LEI
254900AK7VTHB4UYLR40
Ownership Type
Public
Resolution
PARTIAL
Registries Matched
1
Data Quality
0.89

Need a deeper screen on this supplier?

Run the full FEOC pipeline (ownership trace, debt analysis, cert status), with audit trail.

Contact

Prescreen verdicts are deterministic ratings based on registry data (GLEIF, SEC EDGAR, OpenCorporates, Tianyancha) and statutory lists (CSL, OFAC, BIS, UFLPA, NDAA §154b). They are advisory, not legal advice.