Verdex

Part of the chip

Packaged chip

The die packaged and tested.

The step: Assembly, Packaging & Test · Assembly, Packaging & Test

Wafers are probed, thinned, and diced; die attached to substrate or leadframe (wire-bond, flip-chip, or 2.5D/3D); encapsulated; final test. The step that hands over a finished, tested chip. Distinct industry: OSATs — ASE (TW), Amkor (US), JCET (CN), Tongfu (CN), Powertech (TW) — plus captive back-end at IDMs and foundries. >=81% of capacity in Asia.

Equipped by

Open on the map How a chip is made

The map, filtered to who makes this.

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The chip, with the packaged chip lit

Who makes it, by country52 on the index

  1. China14
  2. Taiwan11
  3. United States6
  4. South Korea6
  5. Malaysia4
  6. India4
  7. Japan3
  8. Vietnam1
  9. France1
  10. Philippines1
  11. and 1 more countries

By result

  • CHIPS: Passed25
  • CHIPS: Needs review13
  • CHIPS: Failed14
  • Not screened0

Results under CHIPS and export controls. What each result means

Where they are

141166

Makers on the index

All 52 on the map →