Semiconductors Supply Chain
Assembly, Packaging & Test
Assembly, Packaging & Test
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Semiconductors›Assembly, Packaging & Test
Assembly, Packaging & Test
Wafers are probed, thinned, and diced; die attached to substrate or leadframe (wire-bond, flip-chip, or 2.5D/3D); encapsulated; final test. The step that hands over a finished, tested chip. Distinct industry: OSATs — ASE (TW), Amkor (US), JCET (CN), Tongfu (CN), Powertech (TW) — plus captive back-end at IDMs and foundries. >=81% of capacity in Asia.
Suppliers
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CAUTION
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Process flow
Enabled by this equipment
Upstream inputs
Downstream outputs
None: terminal stage.
Suppliers at this stage
View all 51 →Amkor Technology
Tempe, Arizona · US · OSAT: advanced flip-chip, wire-bond, 2.5D/3D packaging, test
Aoi Electronics Co., Ltd. (アオイ電子)
Takamatsu · JP · OSAT — advanced fan-out laminate package (FOLP), legacy SOP/QFN/DFN, targeting global top-10 OSAT via Sharp plant acquisition
ASE Technology Holding (incl. SPIL)
Kaohsiung · TW · OSAT: wire-bond, flip-chip, 2.5D/3D advanced packaging (VIPack), test
Carsem (Malaysian Pacific Industries / MPI)
Ipoh · MY · OSAT: turnkey packaging and test, automotive/power/AI packages
CG Power and Industrial Solutions (OSAT)
Mumbai (facility: Sanand, Gujarat) · IN · OSAT: new-entrant assembly, packaging and test facility
China Wafer Level CSP (晶方科技)
Suzhou · CN · Wafer-level chip-scale packaging (WLCSP) and test, esp. CMOS image sensors and sensors
Chipbond Technology Corporation
Hsinchu · TW · Display-driver IC packaging and gold-bumping/COF/COG assembly and test
ChipMOS Technologies
Hsinchu · TW · OSAT: display driver IC and memory packaging/test
CT Semiconductor
Bac Ninh · VN · Semiconductor chip assembly, test and packaging (ATP)
Deca Technologies
Tempe, Arizona · US · Advanced fan-out wafer-level packaging (M-Series, Adaptive Patterning)
Globetronics Technology Bhd.
Bayan Lepas, Penang · MY · IC and optoelectronic device assembly/test, sensor and optical module assembly
Greatek Electronics
Taoyuan · TW · OSAT: mid-tier specialty packaging
Hana Micron
Bucheon · KR · OSAT: memory and system semiconductor packaging
Hefei Chipmore Technology (Chipmore/颀中科技)
Hefei · CN · Display driver IC packaging and test (gold/copper bumping, wafer test, COF/COG flip-chip)
HuaCheng Technology (汇成股份)
Hefei · CN · Display driver IC full-process packaging/test (bumping, CP wafer test, COG, COF)
Inari Amertron Berhad
Penang · MY · OSAT for RF, fiber-optic transceivers, optoelectronics, sensors and custom IC assembly/test (SiP)
Integra Technologies
Wichita, Kansas · US · US-based OSAT: advanced packaging and test for domestic supply-chain customers (aerospace/defense-adjacent)
Intel Foundry ASAT (Advanced System Assembly and Test)
Santa Clara, California · US · Captive/merchant advanced packaging: EMIB, Foveros; largest assembly/test site network globally (Vietnam, Malaysia)
JCET Group
Jiangyin · CN · OSAT: wire-bond, flip-chip, advanced packaging, automotive
Kaynes Semicon Private Limited
Sanand, Gujarat · IN · OSAT: chip assembly, testing, marking and packaging; initial output Intelligent Power Modules (IPMs)
King Yuan Electronics (KYEC)
Hsinchu · TW · OSAT: test-focused services (wafer probing, final test)
LB Semicon Inc.
Cheongju · KR · Bumping and packaging services, memory and non-memory IC test
Lingsen Precision Industries, Ltd.
Taichung · TW · IC packaging and testing; optoelectronic device assembly
Liyang Chip Testing / Guangdong Liyang Chip Testing (利扬芯片)
Guangzhou · CN · Independent third-party wafer and finished-chip test (down to 3-16nm nodes)
Micron Technology
Boise, ID · US · IDM, DRAM and NAND memory
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