Part of the chip

Die

The patterned, fabricated circuit, cut from the wafer.

The step: Wafer Fabrication · Wafer Fabrication

Hundreds of process steps (deposition, lithography, etch, implant, CMP, clean, with metrology throughout) build the circuits on the wafer; ~3 months per wafer.

The map, filtered to who makes this.

Loading the model

The chip, with the die lit

Who makes it, by country79 on the index

  1. United States18
  2. China18
  3. Taiwan11
  4. Japan10
  5. South Korea4
  6. Germany4
  7. Singapore2
  8. Netherlands2
  9. Austria1
  10. United Kingdom1
  11. and 8 more countries

By result

  • Clear49
  • Caution8
  • Flagged1
  • Blocked21
  • Not screened0

Results under CHIPS and export controls. What each result means

Where they are

18181110

Makers on the index

All 79 on the map →