Part of the chip
Die
The patterned, fabricated circuit, cut from the wafer.
The step: Wafer Fabrication · Wafer Fabrication
Hundreds of process steps (deposition, lithography, etch, implant, CMP, clean, with metrology throughout) build the circuits on the wafer; ~3 months per wafer.
Made from
Goes into
The map, filtered to who makes this.
Loading the model
The chip, with the die lit
Who makes it, by country79 on the index
- United States18
- China18
- Taiwan11
- Japan10
- South Korea4
- Germany4
- Singapore2
- Netherlands2
- Austria1
- United Kingdom1
- and 8 more countries
By result
- Clear49
- Caution8
- Flagged1
- Blocked21
- Not screened0
Results under CHIPS and export controls. What each result means
Where they are
Makers on the index
All 79 on the map →- Advanced Micro Foundry (AMF)Singapore, SingaporeClear
- Alpha and Omega Semiconductor (AOS)Sunnyvale, CA, United StatesClear
- ams OSRAMPremstaetten, AustriaClear
- Analog Devices (BMS ICs)Wilmington, United StatesClear
- AWSC (Advanced Wireless Semiconductor Company)Hsinchu, TaiwanCaution
- BYD Semiconductor (比亚迪半导体)Shenzhen, ChinaBlocked
- CanSemi Technology (Guangzhou Yuexin Semiconductor, 粤芯半导体)Guangzhou, ChinaBlocked
- CR Micro (China Resources Microelectronics, 华润微电子)Wuxi, ChinaBlocked
- CXMT (ChangXin Memory Technologies)Hefei, ChinaBlocked
- DB HiTekBucheon, South KoreaClear
- DensoKariya, JapanClear
- Diodes IncorporatedPlano, TX, United StatesClear