Verdex

Part of the chip

Substrate

The laminate the die is mounted on inside the package.

The step: Packaging Substrates (ABF/FC-BGA) · Packaging Materials

Organic build-up substrates that carry the die and fan out its connections. Ibiden (JP), Shinko (JP), Unimicron (TW), Nan Ya PCB (TW), AT&S (AT), Samsung E-M (KR); top 5 ~74%.

Made from

Open on the map How a chip is made

The map, filtered to who makes this.

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The chip, with the substrate lit

Who makes it, by country17 on the index

  1. China5
  2. Japan4
  3. Taiwan4
  4. South Korea3
  5. Austria1

By result

  • CHIPS: Passed9
  • CHIPS: Needs review3
  • CHIPS: Failed5
  • Not screened0

Results under CHIPS and export controls. What each result means

Where they are

5

Makers on the index

All 17 on the map →