Semiconductors Supply Chain
Packaging Substrates (ABF/FC-BGA)
Packaging Materials
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Semiconductors›Packaging Materials
Packaging Substrates (ABF/FC-BGA)
Organic build-up substrates that carry the die and fan out its connections. Ibiden (JP), Shinko (JP), Unimicron (TW), Nan Ya PCB (TW), AT&S (AT), Samsung E-M (KR); top 5 ~74%.
Suppliers
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CAUTION
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BLOCKED
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Process flow
Upstream inputs
Downstream outputs
Suppliers at this stage
AT&S
Leoben · AT · FC-BGA / IC substrates
Daeduck Electronics
Seoul · KR · CSP, fcCSP, fcBGA substrates
IBIDEN
Ogaki · JP · Siliconized Graphite| ABF FC-BGA substrates
Kinsus Interconnect Technology
Taoyuan · TW · BGA, FCBGA, HDI substrates
Kyocera
Kyoto · JP · Ceramic and organic IC substrates
LG Innotek
Seoul · KR · Photomasks (display and semiconductor)
Nan Ya PCB
Taoyuan · TW · ABF FC-BGA substrates
NCAP China (National Center for Advanced Packaging)
Wuxi · CN · Advanced packaging / substrate R&D and production platform
Samsung Electro-Mechanics (Semco)
Suwon · KR · FC-BGA, FC-POP substrates
Shennan Circuit
Shenzhen · CN · PCF and ABF-based package substrates
Shenzhen Fastprint Circuit Tech
Shenzhen · CN · IC package substrates
Shinko Electric Industries
Nagano · JP · FC-BGA substrates, also leadframes
Toppan (Tekscend Photomask)
Tokyo · JP · Merchant photomasks, EUV masks
Unimicron Technology
Taoyuan · TW · ABF FC-BGA, IC substrates
Xingsen Technology
Zhaoqing · CN · FC-BGA substrate localization
Zhen Ding Technology
Kaohsiung · TW · IC substrates, SLP, FPC
Zhuhai Access Semiconductor (ACCESS)
Zhuhai · CN · IC package substrates, entering ABF
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