Company record
NCAP China (National Center for Advanced Packaging)
Makes substrate · China
FailedCHIPS and export controls
Incorporated in China, which makes it a foreign entity of concern under the CHIPS rules (15 CFR 231.104).
Based in a covered nation or on a government list. About CHIPS
The check read Home country Owners US government lists
Legal name: NCAP Co.,LTD.
Where it sits
Loading the model
Substrate
The Semiconductors chain, raw material to product
Products on record: Advanced packaging / substrate R&D and production platform
Owners
- Parent
- Consortium incl. JCET, TFME, Huatian, Shennan, CDB Capital
- Ownership
- Joint venture (state-linked)
Locations
- Headquarters
- Wuxi, China
- Production
- Wuxi, China
Sources
- Company registries
- 1 matched
- Government lists
- None matched
Others making substrateChina first
- Shennan CircuitShenzhen, ChinaCHIPS: Failed
- Shenzhen Fastprint Circuit TechShenzhen, ChinaCHIPS: Failed
- Xingsen TechnologyZhaoqing, ChinaCHIPS: Failed
- Zhuhai Access Semiconductor (ACCESS)Zhuhai, ChinaCHIPS: Failed
- Ajinomoto Co., Inc. (Ajinomoto Fine-Techno)Tokyo, JapanCHIPS: Passed
- AT&SLeoben, AustriaCHIPS: Passed
- Daeduck ElectronicsSeoul, South KoreaCHIPS: Needs review
- IBIDENOgaki, JapanCHIPS: Passed
Automated results come from registry sources, read by fixed rules, with research findings where the registries stop. The chip results also read the US government lists; for FEOC the lists are read in a full screen. They are advisory, not legal advice. The full report, every test with its sources, is on request. Contact us