Company record
NCAP China (National Center for Advanced Packaging)
Makes substrate · China
BlockedCHIPS and export controls
Incorporated in China, which makes it a foreign entity of concern under the CHIPS rules (15 CFR 231.104).
Based in a country of concern, owned from one, or on a government list. About CHIPS
The check read Home country Owners US government lists
Legal name: NCAP Co.,LTD.
Where it sits
Loading the model
Substrate
The Semiconductors chain, raw material to product
Products on record: Advanced packaging / substrate R&D and production platform
Owners
- Parent
- Consortium incl. JCET, TFME, Huatian, Shennan, CDB Capital
- Ownership
- Joint venture (state-linked)
Locations
- Headquarters
- Wuxi, China
- Production
- Wuxi, China
Sources
- Company registries
- 1 matched
- Government lists
- None matched
Others making substrateChina first
- Shennan CircuitShenzhen, ChinaBlocked
- Shenzhen Fastprint Circuit TechShenzhen, ChinaBlocked
- Xingsen TechnologyZhaoqing, ChinaBlocked
- Zhuhai Access Semiconductor (ACCESS)Zhuhai, ChinaBlocked
- Ajinomoto Co., Inc. (Ajinomoto Fine-Techno)Tokyo, JapanClear
- AT&SLeoben, AustriaClear
- Daeduck ElectronicsSeoul, South KoreaCaution
- IBIDENOgaki, JapanClear
Automated results come from registry sources, read by fixed rules, with research findings where the registries stop. The chip results also read the US government lists; for FEOC the lists are read in a full screen. They are advisory, not legal advice. A reviewed report is written by a person on request. Contact us