Part of the chip

Substrate

The laminate the die is mounted on inside the package.

The step: ABF Film · Packaging Materials

Ajinomoto Build-up Film, the insulating layer laminated into high-end substrates. Ajinomoto (JP) is the sole supplier — the sector's quietest single point of failure.

The map, filtered to who makes this.

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The chip, with the substrate lit

Who makes it, by country1 on the index

  1. Japan1

By result

  • Clear1
  • Caution0
  • Flagged0
  • Blocked0
  • Not screened0

Results under CHIPS and export controls. What each result means

Where they are

Makers on the index

All 1 on the map →