Part of the chip
Substrate
The laminate the die is mounted on inside the package.
The step: ABF Film · Packaging Materials
Ajinomoto Build-up Film, the insulating layer laminated into high-end substrates. Ajinomoto (JP) is the sole supplier — the sector's quietest single point of failure.
Goes into
The map, filtered to who makes this.
Loading the model
The chip, with the substrate lit
Who makes it, by country1 on the index
- Japan1
By result
- Clear1
- Caution0
- Flagged0
- Blocked0
- Not screened0
Results under CHIPS and export controls. What each result means