Company record

Kinsus Interconnect Technology

Makes substrate · Taiwan

Needs reviewCHIPS and export controls

Too little confirmed ownership data to clear it under the CHIPS rules: a gap in the data, not a finding against it.

Something needs a person to read it: the reason line says what. About CHIPS

The check read Home country Owners US government lists

Where it sits

Loading the model
Substrate

The Semiconductors chain, raw material to product

  1. ABF Film
  2. Packaging Substrates (ABF/FC-BGA)
  3. Assembly, Packaging & Test

Products on record: BGA, FCBGA, HDI substrates

Owners

Parent
None on record
Ownership
Public

Locations

Headquarters
Taoyuan, Taiwan
Production
  • Taoyuan, Taiwan

Sources

Company registries
unresolved
Government lists
None matched

Others making substrateTaiwan first

Automated results come from registry sources, read by fixed rules, with research findings where the registries stop. The chip results also read the US government lists; for FEOC the lists are read in a full screen. They are advisory, not legal advice. The full report, every test with its sources, is on request. Contact us