Company Dossier
Kinsus Interconnect Technology
Taoyuan · Taiwan
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Semiconductor · Packaging Substrates (ABF/FC-BGA)
Kinsus Interconnect Technology
Taoyuan · Taiwan
Kinsus Interconnect Technology is a company in the semiconductor supply chain, operating in Packaging Substrates (ABF/FC-BGA), based in Taoyuan, Taiwan. Its main product line is BGA, FCBGA, HDI substrates.
FEOC Prescreen Verdict
confidence: deterministic
Private entity — ownership publicly undetermined
CHIPS / Export-Control Verdict
CAUTION
Not enough verified ownership evidence to clear the CHIPS entity tests — data gap, not a verdict
- CH-OPAQUE — Screening data-quality rule (no statutory basis; a data gap, not a verdict)
Country
Taiwan
HQ City
Taoyuan
Sector
Semiconductor
Category
Packaging Substrates (ABF/FC-BGA)
Product Line
BGA, FCBGA, HDI substrates
Production Locations
Taoyuan Taiwan
Ownership Type
Public
Resolution
UNRESOLVED
Registries Matched
0
Data Quality
0.67
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Prescreen verdicts are deterministic ratings based on registry data (GLEIF, SEC EDGAR, OpenCorporates, Tianyancha) and statutory lists (CSL, OFAC, BIS, UFLPA, NDAA §154b). They are advisory, not legal advice.