Company record
China Wafer Level CSP (晶方科技)
Makes packaged chip · China
BlockedCHIPS and export controls
Incorporated in China, which makes it a foreign entity of concern under the CHIPS rules (15 CFR 231.104).
Based in a country of concern, owned from one, or on a government list. About CHIPS
The check read Home country Owners US government lists
Legal name: China Wafer Level CSP Co.,Ltd.
Where it sits
Loading the model
Packaged chip
The Semiconductors chain, raw material to product
Products on record: Wafer-level chip-scale packaging (WLCSP) and test, esp. CMOS image sensors and sensors
Owners
- Parent
- None on record
- Ownership
- Public
Locations
- Headquarters
- Suzhou, China
- Production
- Suzhou, China
Sources
- Company registries
- 1 matched
- Government lists
- None matched
Others making packaged chipChina first
- Hefei Chipmore Technology (Chipmore/颀中科技)Hefei, ChinaBlocked
- HuaCheng Technology (汇成股份)Hefei, ChinaBlocked
- JCET GroupJiangyin, ChinaBlocked
- Liyang Chip Testing / Guangdong Liyang Chip Testing (利扬芯片)Guangzhou, ChinaBlocked
- QP Technology (气派科技)Dongguan, ChinaBlocked
- Sino IC Technology / Shanghai Huailing (华岭股份)Shanghai, ChinaBlocked
- SJ Semiconductor (SJSemi / 盛合晶微半导体)Jiangyin, ChinaBlocked
- Tianshui Huatian Technology (HT-Tech)Tianshui, Gansu, ChinaBlocked
Automated results come from registry sources, read by fixed rules, with research findings where the registries stop. The chip results also read the US government lists; for FEOC the lists are read in a full screen. They are advisory, not legal advice. A reviewed report is written by a person on request. Contact us