Company record
QP Technology (气派科技)
Makes packaged chip · China
FailedCHIPS and export controls
Incorporated in China, which makes it a foreign entity of concern under the CHIPS rules (15 CFR 231.104).
Based in a covered nation or on a government list. About CHIPS
The check read Home country Owners US government lists
Legal name: China Chippcking Technology Co.,Ltd.
Where it sits
Loading the model
Packaged chip
The Semiconductors chain, raw material to product
Products on record: IC packaging and test: SOP, SOT, QFN/DFN, LQFP, DIP families (120+ package types)
Owners
- Parent
- None on record
- Ownership
- Public
Locations
- Headquarters
- Dongguan, China
- Production
- Dongguan, China
Sources
- Company registries
- 1 matched
- Government lists
- None matched
Others making packaged chipChina first
- China Wafer Level CSP (晶方科技)Suzhou, ChinaCHIPS: Failed
- EEMS SuzhouChinaCHIPS: Failed
- Hefei Chipmore Technology (Chipmore/颀中科技)Hefei, ChinaCHIPS: Failed
- HuaCheng Technology (汇成股份)Hefei, ChinaCHIPS: Failed
- JCET GroupJiangyin, ChinaCHIPS: Failed
- Liyang Chip Testing / Guangdong Liyang Chip Testing (利扬芯片)Guangzhou, ChinaCHIPS: Failed
- Sino IC Technology / Shanghai Huailing (华岭股份)Shanghai, ChinaCHIPS: Failed
- SJ Semiconductor (SJSemi / 盛合晶微半导体)Jiangyin, ChinaCHIPS: Failed
Automated results come from registry sources, read by fixed rules, with research findings where the registries stop. The chip results also read the US government lists; for FEOC the lists are read in a full screen. They are advisory, not legal advice. The full report, every test with its sources, is on request. Contact us