Company record
EEMS Suzhou
Makes packaged chip · China
Incorporated in China, which makes it a foreign entity of concern under the CHIPS rules (15 CFR 231.104).
Based in a covered nation or on a government list. About CHIPS
Legal name: EEMS Suzhou Co., Ltd.
Where it sits
The Semiconductors chain, raw material to product
Products on record: Assembly, final test, module and system level test services for semiconductor packaging, including leadframe and substrate packaging
Owners
Not on record.
Locations
- Headquarters
- China
- Production
- Not on record
On the map at the country centroid: the city is not on record.
Sources
- Company registries
- unresolved
- Government lists
- None matched
Others making packaged chipChina first
- China Wafer Level CSP (晶方科技)Suzhou, ChinaCHIPS: Failed
- Hefei Chipmore Technology (Chipmore/颀中科技)Hefei, ChinaCHIPS: Failed
- HuaCheng Technology (汇成股份)Hefei, ChinaCHIPS: Failed
- JCET GroupJiangyin, ChinaCHIPS: Failed
- Liyang Chip Testing / Guangdong Liyang Chip Testing (利扬芯片)Guangzhou, ChinaCHIPS: Failed
- QP Technology (气派科技)Dongguan, ChinaCHIPS: Failed
- Sino IC Technology / Shanghai Huailing (华岭股份)Shanghai, ChinaCHIPS: Failed
- SJ Semiconductor (SJSemi / 盛合晶微半导体)Jiangyin, ChinaCHIPS: Failed
Automated results come from registry sources, read by fixed rules, with research findings where the registries stop. The chip results also read the US government lists; for FEOC the lists are read in a full screen. They are advisory, not legal advice. The full report, every test with its sources, is on request. Contact us