Company record
SJ Semiconductor (SJSemi / 盛合晶微半导体)
Makes packaged chip · China
On the BIS Entity List: exports to it need a US license, which is presumed denied. Listed as SJ Semiconductor. Incorporated in China, which makes it a foreign entity of concern under the CHIPS rules (15 CFR 231.104). Named in Section 5949 of the FY2023 NDAA: from Dec 23, 2027, US federal agencies may not buy products that contain its chips.
Based in a covered nation or on a government list. About CHIPS
Legal name: Shenghejing Micro Semiconductor (Jiangyin) Co., Ltd.
Where it sits
The Semiconductors chain, raw material to product
Products on record: Middle-end-of-line (MEOL) wafer bumping and advanced packaging: WLCSP, 2.5D/3D chiplet packaging
Owners
- Parent
- Founded by SMIC and JCET alliance; SMIC/Qualcomm investors
- Ownership
- Private (STAR Market IPO pending 2026)
Locations
- Headquarters
- Jiangyin, China
- Production
- Jiangyin, China
- Shanghai, China (Lingang, under construction)
Sources
- Company registries
- 1 matched
- Government lists
- Match found
Others making packaged chipChina first
- China Wafer Level CSP (晶方科技)Suzhou, ChinaCHIPS: Failed
- EEMS SuzhouChinaCHIPS: Failed
- Hefei Chipmore Technology (Chipmore/颀中科技)Hefei, ChinaCHIPS: Failed
- HuaCheng Technology (汇成股份)Hefei, ChinaCHIPS: Failed
- JCET GroupJiangyin, ChinaCHIPS: Failed
- Liyang Chip Testing / Guangdong Liyang Chip Testing (利扬芯片)Guangzhou, ChinaCHIPS: Failed
- QP Technology (气派科技)Dongguan, ChinaCHIPS: Failed
- Sino IC Technology / Shanghai Huailing (华岭股份)Shanghai, ChinaCHIPS: Failed
Automated results come from registry sources, read by fixed rules, with research findings where the registries stop. The chip results also read the US government lists; for FEOC the lists are read in a full screen. They are advisory, not legal advice. The full report, every test with its sources, is on request. Contact us