Semiconductors Supply Chain
Mold Compounds & Underfill
Packaging Materials
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Semiconductors›Packaging Materials
Mold Compounds & Underfill
Epoxy mold compounds that encapsulate the die and underfill materials for flip-chip joints. Leader set to be firmed up during Step 2 company search.
Suppliers
15
CLEAR
11
CAUTION
2
FLAGGED
0
BLOCKED
2
Process flow
Upstream inputs
None: first stage.
Downstream outputs
Suppliers at this stage
Chang Chun Group
Taipei · TW · Copper Foil| Epoxy mold compound
Darbond Technology
Yantai, Shandong · CN · IC packaging materials incl. epoxy mold compound
Henkel
Dusseldorf · DE · Underfill (capillary flow and no-flow) for flip-chip/BGA
Hysol Huawei Electronics (Jiangsu Hengsuo Hysol Huawei)
Jiangsu · CN · Epoxy molding compounds
KCC Corporation
Seoul · KR · Epoxy mold compound
Kyocera
Kyoto · JP · Ceramic and organic IC substrates
MacDermid Alpha Advanced Materials
Waterbury, CT · US · Underfill materials
Nagase ChemteX
Osaka · JP · Underfill for flip-chip and BGA packaging
NAMICS Corporation
Niigata · JP · Silver paste / metallization| Silver Paste| Capillary underfill for flip-chip packaging
Panasonic
Osaka · JP · Epoxy mold compound
QS Advanced Materials Inc.
Kennebunk ME · US · Quartz Crucible Manufacturing| Plastic packaging compounds (EMC)
Samsung SDI Co. Ltd.
Yongin (Gyeonggi-do) · KR · Silver Powder/Paste Refining| Silver paste / metallization| BESS Integrator; Cathode Active Material (CAM); Cell Manufacturer (NCA); Cell Manufacturer (NMC); Cell Manufacturer (Solid-state); Module Assembler; Pack Assembler| NCA, NMC, LFP (BESS/EV)| Epoxy mold compound
Shin-Etsu Chemical
Tokyo · JP · Ingot; Wafer| Anode Active Material (Silicon)| High-purity photoresists, DRAM-focused
Showa Denko K.K. (now Resonac)
Tokyo · JP · Aluminum Foil
Sumitomo Bakelite Co.
Tokyo · JP · Anode Active Material (Hard Carbon)| Epoxy mold compound (SUMIKON EME)
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