Verdex

Part of the chip

Mold compound

The epoxy that encases the die.

The step: Mold Compounds & Underfill · Packaging Materials

Epoxy mold compounds that encapsulate the die and underfill materials for flip-chip joints.

Open on the map How a chip is made

The map, filtered to who makes this.

Loading the model

The chip, with the mold compound lit

Who makes it, by country15 on the index

  1. Japan7
  2. China2
  3. South Korea2
  4. United States2
  5. Taiwan1
  6. Germany1

By result

  • CHIPS: Passed11
  • CHIPS: Needs review2
  • CHIPS: Failed2
  • Not screened0

Results under CHIPS and export controls. What each result means

Where they are

7

Makers on the index

All 15 on the map →