NAMICS Corporation

Passed

Makes silver paste & metallization · Niigata, Japan · NAMICS AG

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Where it sits

Loading the model
Not a part of the solar module; a step on its chain

Also on the Semiconductors chain (Mold Compounds & Underfill).

Others making silver paste & metallization: Gonda Electronic, Mitsubishi Materials Corporation, Noritake Co., SSP Co. Ltd., Toyo Aluminium (Toyal Solar), Toyo Ink Group, AG PRO, ANP Co., LTD and 33 more.

Parent
Nagase
Ownership
Private
Headquarters
Niigata, Japan
Production
  • Niigata, Japan
Products
Silver paste / metallization| Silver Paste| Capillary underfill for flip-chip packaging
Company registries
unresolved
Registry identifier
213800GCC28JTJAMZH48
Government lists
None matched
Research findings
Not needed; registry data decided it

Checks

  • Passed

    Not based in a country of concern and on no US government list. FEOC · About FEOC

    Screen this supplier
  • Needs review

    Too little confirmed ownership data to clear it under the CHIPS rules: a gap in the data, not a finding against it. CHIPS and export controls · About CHIPS

    CH-OPAQUE · Screening data-quality rule (no statutory basis; a data gap, not a verdict)

Automated results from registry sources, read by fixed rules, with research findings where the registries stop: advisory, not legal advice. The full report, every test with its sources, is on request. Contact us