Company record
Hysol Huawei Electronics (Jiangsu Hengsuo Hysol Huawei)
Makes mold compound · China
FailedCHIPS and export controls
Incorporated in China, which makes it a foreign entity of concern under the CHIPS rules (15 CFR 231.104).
Based in a covered nation or on a government list. About CHIPS
The check read Home country Owners US government lists
Where it sits
Loading the model
Mold compound
The Semiconductors chain, raw material to product
Products on record: Epoxy molding compounds
Owners
- Parent
- Darbond Technology (53% stake)
- Ownership
- Private (majority acquired by Darbond)
Locations
- Headquarters
- Jiangsu, China
- Production
- Jiangsu, China
On the map at a regional stand-in: the city is not on record.
Sources
- Company registries
- unresolved
- Government lists
- None matched
Others making mold compoundChina first
- Darbond TechnologyYantai, Shandong, ChinaCHIPS: Failed
- Chang Chun GroupTaipei, TaiwanCHIPS: Needs review
- HenkelDusseldorf, GermanyCHIPS: Passed
- KCC CorporationSeoul, South KoreaCHIPS: Passed
- KyoceraKyoto, JapanCHIPS: Passed
- MacDermid Alpha Advanced MaterialsWaterbury, CT, United StatesCHIPS: Passed
- Nagase ChemteXOsaka, JapanCHIPS: Passed
- NAMICS CorporationNiigata, JapanCHIPS: Needs review
Automated results come from registry sources, read by fixed rules, with research findings where the registries stop. The chip results also read the US government lists; for FEOC the lists are read in a full screen. They are advisory, not legal advice. The full report, every test with its sources, is on request. Contact us