Company record
Henkel
Makes mold compound · Germany
ClearCHIPS and export controls
Not incorporated in a country of concern, with no US government list entry and no owner from such a country in the screening record.
The automated check found no tie to a country of concern. About CHIPS
The check read Home country Owners US government lists
Legal name: HENKEL LIMITED
Where it sits
Loading the model
Mold compound
The Semiconductors chain, raw material to product
Products on record: Underfill (capillary flow and no-flow) for flip-chip/BGA
Owners
- Parent
- None on record
- Ownership
- Public
Locations
- Headquarters
- Dusseldorf, Germany
- Production
- Germany
- Global sites
Sources
- Company registries
- 1 matched
- Registry identifier
- 529900YQNV78NXANRR03
- Government lists
- None matched
Others making mold compoundGermany first
- Chang Chun GroupTaipei, TaiwanCaution
- Darbond TechnologyYantai, Shandong, ChinaBlocked
- Hysol Huawei Electronics (Jiangsu Hengsuo Hysol Huawei)Jiangsu, ChinaBlocked
- KCC CorporationSeoul, South KoreaClear
- KyoceraKyoto, JapanClear
- MacDermid Alpha Advanced MaterialsWaterbury, CT, United StatesClear
- Nagase ChemteXOsaka, JapanClear
- NAMICS CorporationNiigata, JapanCaution
Automated results come from registry sources, read by fixed rules, with research findings where the registries stop. The chip results also read the US government lists; for FEOC the lists are read in a full screen. They are advisory, not legal advice. A reviewed report is written by a person on request. Contact us