Company record
Henkel
Makes mold compound · Germany
PassedCHIPS and export controls
Not incorporated in a country of concern, with no US government list entry and no owner from such a country in the screening record.
Not based in a covered nation and on no government list. About CHIPS
The check read Home country Owners US government lists
Legal name: HENKEL LIMITED
Where it sits
Loading the model
Mold compound
The Semiconductors chain, raw material to product
Products on record: Underfill (capillary flow and no-flow) for flip-chip/BGA
Owners
- Parent
- None on record
- Ownership
- Public
Locations
- Headquarters
- Dusseldorf, Germany
- Production
- Germany
- Global sites
Sources
- Company registries
- 1 matched
- Registry identifier
- 529900YQNV78NXANRR03
- Government lists
- None matched
Others making mold compoundGermany first
- Chang Chun GroupTaipei, TaiwanCHIPS: Needs review
- Darbond TechnologyYantai, Shandong, ChinaCHIPS: Failed
- Hysol Huawei Electronics (Jiangsu Hengsuo Hysol Huawei)Jiangsu, ChinaCHIPS: Failed
- KCC CorporationSeoul, South KoreaCHIPS: Passed
- KyoceraKyoto, JapanCHIPS: Passed
- MacDermid Alpha Advanced MaterialsWaterbury, CT, United StatesCHIPS: Passed
- Nagase ChemteXOsaka, JapanCHIPS: Passed
- NAMICS CorporationNiigata, JapanCHIPS: Needs review
Automated results come from registry sources, read by fixed rules, with research findings where the registries stop. The chip results also read the US government lists; for FEOC the lists are read in a full screen. They are advisory, not legal advice. The full report, every test with its sources, is on request. Contact us