Company record
Darbond Technology
Makes mold compound · China
FailedCHIPS and export controls
Incorporated in China, which makes it a foreign entity of concern under the CHIPS rules (15 CFR 231.104).
Based in a covered nation or on a government list. About CHIPS
The check read Home country Owners US government lists
Legal name: Yantai Darbond Technology Co., Ltd.
Where it sits
Loading the model
Mold compound
The Semiconductors chain, raw material to product
Products on record: IC packaging materials incl. epoxy mold compound
Owners
- Parent
- None on record
- Ownership
- Public
Locations
- Headquarters
- Yantai, Shandong, China
- Production
- Yantai, China
Sources
- Company registries
- 1 matched
- Government lists
- None matched
Others making mold compoundChina first
- Hysol Huawei Electronics (Jiangsu Hengsuo Hysol Huawei)Jiangsu, ChinaCHIPS: Failed
- Chang Chun GroupTaipei, TaiwanCHIPS: Needs review
- HenkelDusseldorf, GermanyCHIPS: Passed
- KCC CorporationSeoul, South KoreaCHIPS: Passed
- KyoceraKyoto, JapanCHIPS: Passed
- MacDermid Alpha Advanced MaterialsWaterbury, CT, United StatesCHIPS: Passed
- Nagase ChemteXOsaka, JapanCHIPS: Passed
- NAMICS CorporationNiigata, JapanCHIPS: Needs review
Automated results come from registry sources, read by fixed rules, with research findings where the registries stop. The chip results also read the US government lists; for FEOC the lists are read in a full screen. They are advisory, not legal advice. The full report, every test with its sources, is on request. Contact us