Company record
Darbond Technology
Makes mold compound · China
BlockedCHIPS and export controls
Incorporated in China, which makes it a foreign entity of concern under the CHIPS rules (15 CFR 231.104).
Based in a country of concern, owned from one, or on a government list. About CHIPS
The check read Home country Owners US government lists
Legal name: Yantai Darbond Technology Co., Ltd.
Where it sits
Loading the model
Mold compound
The Semiconductors chain, raw material to product
Products on record: IC packaging materials incl. epoxy mold compound
Owners
- Parent
- None on record
- Ownership
- Public
Locations
- Headquarters
- Yantai, Shandong, China
- Production
- Yantai, China
Sources
- Company registries
- 1 matched
- Government lists
- None matched
Others making mold compoundChina first
- Hysol Huawei Electronics (Jiangsu Hengsuo Hysol Huawei)Jiangsu, ChinaBlocked
- Chang Chun GroupTaipei, TaiwanCaution
- HenkelDusseldorf, GermanyClear
- KCC CorporationSeoul, South KoreaClear
- KyoceraKyoto, JapanClear
- MacDermid Alpha Advanced MaterialsWaterbury, CT, United StatesClear
- Nagase ChemteXOsaka, JapanClear
- NAMICS CorporationNiigata, JapanCaution
Automated results come from registry sources, read by fixed rules, with research findings where the registries stop. The chip results also read the US government lists; for FEOC the lists are read in a full screen. They are advisory, not legal advice. A reviewed report is written by a person on request. Contact us