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Company Dossier

Darbond Technology

Yantai, Shandong · China

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Semiconductor · Mold Compounds & Underfill

Darbond Technology

Yantai Darbond Technology Co., Ltd.

Yantai, Shandong · China

BLOCKED

Darbond Technology is a company in the semiconductor supply chain, operating in Mold Compounds & Underfill, based in Yantai, Shandong, China. Its main product line is IC packaging materials incl. epoxy mold compound.

FEOC Prescreen Verdict
confidence: deterministic

Entity incorporated in covered nation (CN)

CHIPS / Export-Control Verdict
BLOCKED

Incorporated in a covered nation (CN) — a foreign entity of concern under the CHIPS guardrails (15 CFR 231.104)

  • CH-NATION — 15 CFR 231.104; 10 U.S.C. 4872(d); guardrails at 15 CFR 231.202–231.203
Country
China
HQ City
Yantai, Shandong
Sector
Semiconductor
Category
Mold Compounds & Underfill
Product Line
IC packaging materials incl. epoxy mold compound
Production Locations
Yantai China
Ownership Type
Public
Resolution
PARTIAL
Registries Matched
1
Data Quality
0.78

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Prescreen verdicts are deterministic ratings based on registry data (GLEIF, SEC EDGAR, OpenCorporates, Tianyancha) and statutory lists (CSL, OFAC, BIS, UFLPA, NDAA §154b). They are advisory, not legal advice.