Company record
Deca Technologies
Makes packaged chip · United States
Needs reviewCHIPS and export controls
Too little confirmed ownership data to clear it under the CHIPS rules: a gap in the data, not a finding against it.
Something needs a person to read it: the reason line says what. About CHIPS
The check read Home country Owners US government lists
Where it sits
Loading the model
Packaged chip
The Semiconductors chain, raw material to product
Products on record: Advanced fan-out wafer-level packaging (M-Series, Adaptive Patterning)
Owners
- Parent
- Formerly Cypress Semiconductor spin-off; now independent
- Ownership
- Private
Locations
- Headquarters
- Tempe, Arizona, United States
- Production
- Tempe, United States
- Chandler, United States
Sources
- Company registries
- unresolved
- Government lists
- None matched
Others making packaged chipUnited States first
- Amkor TechnologyTempe, Arizona, United StatesCHIPS: Passed
- Integra TechnologiesWichita, Kansas, United StatesCHIPS: Passed
- Intel Foundry ASAT (Advanced System Assembly and Test)Santa Clara, California, United StatesCHIPS: Passed
- Micron TechnologyBoise, ID, United StatesCHIPS: Passed
- Texas Instruments (BMS ICs)Dallas, United StatesCHIPS: Passed
- Aoi Electronics Co., Ltd. (アオイ電子)Takamatsu, JapanCHIPS: Passed
- ASE Technology Holding (incl. SPIL)Kaohsiung, TaiwanCHIPS: Passed
- Carsem (Malaysian Pacific Industries / MPI)Ipoh, MalaysiaCHIPS: Passed
Automated results come from registry sources, read by fixed rules, with research findings where the registries stop. The chip results also read the US government lists; for FEOC the lists are read in a full screen. They are advisory, not legal advice. The full report, every test with its sources, is on request. Contact us