Company record
Amkor Technology
Makes packaged chip · United States
PassedCHIPS and export controls
Not incorporated in a country of concern, with no US government list entry and no owner from such a country in the screening record.
Not based in a covered nation and on no government list. About CHIPS
The check read Home country Owners US government lists
Legal name: 앰코테크놀로지코리아 주식회사
Where it sits
Loading the model
Packaged chip
The Semiconductors chain, raw material to product
Products on record: OSAT: advanced flip-chip, wire-bond, 2.5D/3D packaging, test
Owners
- Parent
- None on record
- Ownership
- Public
Locations
- Headquarters
- Tempe, Arizona, United States
- Production
- Chandler Arizona, US
- Peoria Arizona, US
- Incheon, South Korea
- Cebu, Philippines
- Bac Ninh, Vietnam
- Braga, Portugal
- Bangkok, Thailand
Sources
- Company registries
- 1 matched
- Registry identifier
- 988400EUOLSPHVR8UP14
- Government lists
- None matched
Others making packaged chipUnited States first
- Deca TechnologiesTempe, Arizona, United StatesCHIPS: Needs review
- Integra TechnologiesWichita, Kansas, United StatesCHIPS: Passed
- Intel Foundry ASAT (Advanced System Assembly and Test)Santa Clara, California, United StatesCHIPS: Passed
- Micron TechnologyBoise, ID, United StatesCHIPS: Passed
- Texas Instruments (BMS ICs)Dallas, United StatesCHIPS: Passed
- Aoi Electronics Co., Ltd. (アオイ電子)Takamatsu, JapanCHIPS: Passed
- ASE Technology Holding (incl. SPIL)Kaohsiung, TaiwanCHIPS: Passed
- Carsem (Malaysian Pacific Industries / MPI)Ipoh, MalaysiaCHIPS: Passed
Automated results come from registry sources, read by fixed rules, with research findings where the registries stop. The chip results also read the US government lists; for FEOC the lists are read in a full screen. They are advisory, not legal advice. The full report, every test with its sources, is on request. Contact us