Company record
Globetronics Technology Bhd.
Makes packaged chip · Malaysia
Too little confirmed ownership data to clear it under the CHIPS rules: a gap in the data, not a finding against it.
Something could not be confirmed, often owners that are not public. About CHIPS
Where it sits
The Semiconductors chain, raw material to product
Products on record: IC and optoelectronic device assembly/test, sensor and optical module assembly
Owners
- Parent
- None on record
- Ownership
- Public
Locations
- Headquarters
- Bayan Lepas, Penang, Malaysia
- Production
- Bayan Lepas Penang, Malaysia
On the map at a regional stand-in: the city is not on record.
Sources
- Company registries
- unresolved
- Government lists
- None matched
Others making packaged chipMalaysia first
- Carsem (Malaysian Pacific Industries / MPI)Ipoh, MalaysiaClear
- Inari Amertron BerhadPenang, MalaysiaCaution
- Unisem GroupKuala Lumpur, MalaysiaClear
- Amkor TechnologyTempe, Arizona, United StatesClear
- Aoi Electronics Co., Ltd. (アオイ電子)Takamatsu, JapanClear
- ASE Technology Holding (incl. SPIL)Kaohsiung, TaiwanClear
- CG Power and Industrial Solutions (OSAT)Mumbai (facility: Sanand, Gujarat), IndiaClear
- China Wafer Level CSP (晶方科技)Suzhou, ChinaBlocked
Automated results come from registry sources, read by fixed rules, with research findings where the registries stop. The chip results also read the US government lists; for FEOC the lists are read in a full screen. They are advisory, not legal advice. A reviewed report is written by a person on request. Contact us