Company record
Globetronics Technology Bhd.
Makes packaged chip · Malaysia
Too little confirmed ownership data to clear it under the CHIPS rules: a gap in the data, not a finding against it.
Something needs a person to read it: the reason line says what. About CHIPS
Where it sits
The Semiconductors chain, raw material to product
Products on record: IC and optoelectronic device assembly/test, sensor and optical module assembly
Owners
- Parent
- None on record
- Ownership
- Public
Locations
- Headquarters
- Bayan Lepas, Penang, Malaysia
- Production
- Bayan Lepas Penang, Malaysia
On the map at a regional stand-in: the city is not on record.
Sources
- Company registries
- unresolved
- Government lists
- None matched
Others making packaged chipMalaysia first
- Carsem (Malaysian Pacific Industries / MPI)Ipoh, MalaysiaCHIPS: Passed
- Inari Amertron BerhadPenang, MalaysiaCHIPS: Needs review
- Unisem GroupKuala Lumpur, MalaysiaCHIPS: Passed
- Amkor TechnologyTempe, Arizona, United StatesCHIPS: Passed
- Aoi Electronics Co., Ltd. (アオイ電子)Takamatsu, JapanCHIPS: Passed
- ASE Technology Holding (incl. SPIL)Kaohsiung, TaiwanCHIPS: Passed
- CG Power and Industrial Solutions (OSAT)Mumbai (facility: Sanand, Gujarat), IndiaCHIPS: Passed
- China Wafer Level CSP (晶方科技)Suzhou, ChinaCHIPS: Failed
Automated results come from registry sources, read by fixed rules, with research findings where the registries stop. The chip results also read the US government lists; for FEOC the lists are read in a full screen. They are advisory, not legal advice. The full report, every test with its sources, is on request. Contact us