Company record
Unisem Group
Makes packaged chip · Malaysia
ClearCHIPS and export controls
Not incorporated in a country of concern, with no US government list entry and no owner from such a country in the screening record.
The automated check found no tie to a country of concern. About CHIPS
The check read Home country Owners US government lists
Legal name: UNISEM SA
Where it sits
Loading the model
Packaged chip
The Semiconductors chain, raw material to product
Products on record: OSAT: wafer bumping, IC packaging, RF/mixed-signal test
Owners
- Parent
- None on record
- Ownership
- Public
Locations
- Headquarters
- Kuala Lumpur, Malaysia
- Production
- Ipoh, Malaysia
- Chengdu, China
- Batam, Indonesia
Sources
- Company registries
- 1 matched
- Registry identifier
- 254900ADLUFRBNFLUL27
- Government lists
- None matched
Others making packaged chipMalaysia first
- Carsem (Malaysian Pacific Industries / MPI)Ipoh, MalaysiaClear
- Globetronics Technology Bhd.Bayan Lepas, Penang, MalaysiaCaution
- Inari Amertron BerhadPenang, MalaysiaCaution
- Amkor TechnologyTempe, Arizona, United StatesClear
- Aoi Electronics Co., Ltd. (アオイ電子)Takamatsu, JapanClear
- ASE Technology Holding (incl. SPIL)Kaohsiung, TaiwanClear
- CG Power and Industrial Solutions (OSAT)Mumbai (facility: Sanand, Gujarat), IndiaClear
- China Wafer Level CSP (晶方科技)Suzhou, ChinaBlocked
Automated results come from registry sources, read by fixed rules, with research findings where the registries stop. The chip results also read the US government lists; for FEOC the lists are read in a full screen. They are advisory, not legal advice. A reviewed report is written by a person on request. Contact us