Company record
Unisem Group
Makes packaged chip · Malaysia
PassedCHIPS and export controls
Not incorporated in a country of concern, with no US government list entry and no owner from such a country in the screening record.
Not based in a covered nation and on no government list. About CHIPS
The check read Home country Owners US government lists
Legal name: UNISEM SA
Where it sits
Loading the model
Packaged chip
The Semiconductors chain, raw material to product
Products on record: OSAT: wafer bumping, IC packaging, RF/mixed-signal test
Owners
- Parent
- None on record
- Ownership
- Public
Locations
- Headquarters
- Kuala Lumpur, Malaysia
- Production
- Ipoh, Malaysia
- Chengdu, China
- Batam, Indonesia
Sources
- Company registries
- 1 matched
- Registry identifier
- 254900ADLUFRBNFLUL27
- Government lists
- None matched
Others making packaged chipMalaysia first
- Carsem (Malaysian Pacific Industries / MPI)Ipoh, MalaysiaCHIPS: Passed
- Globetronics Technology Bhd.Bayan Lepas, Penang, MalaysiaCHIPS: Needs review
- Inari Amertron BerhadPenang, MalaysiaCHIPS: Needs review
- Amkor TechnologyTempe, Arizona, United StatesCHIPS: Passed
- Aoi Electronics Co., Ltd. (アオイ電子)Takamatsu, JapanCHIPS: Passed
- ASE Technology Holding (incl. SPIL)Kaohsiung, TaiwanCHIPS: Passed
- CG Power and Industrial Solutions (OSAT)Mumbai (facility: Sanand, Gujarat), IndiaCHIPS: Passed
- China Wafer Level CSP (晶方科技)Suzhou, ChinaCHIPS: Failed
Automated results come from registry sources, read by fixed rules, with research findings where the registries stop. The chip results also read the US government lists; for FEOC the lists are read in a full screen. They are advisory, not legal advice. The full report, every test with its sources, is on request. Contact us