Chips · Equipment
Assembly & Test Equipment
Die/wire bonders, molding systems, and automated test equipment for the back end. ASMPT (HK/SG), Besi (NL), Kulicke & Soffa (SG/US); test: Advantest (JP), Teradyne (US).
Equipment for
The map, filtered to who makes this.
Who makes it, by country36 on the index
- Japan8
- United States6
- China6
- Malaysia4
- Germany3
- Hong Kong SAR China2
- Taiwan2
- Netherlands1
- South Korea1
- Singapore1
- and 2 more countries
By result
- Clear21
- Caution8
- Flagged0
- Blocked7
- Not screened0
Results under CHIPS and export controls. What each result means
Where they are
Makers on the index
All 36 on the map →- ACCRETECH / Tokyo Seimitsu Co., Ltd.Tokyo, JapanClear
- Advantest CorporationTokyo, JapanClear
- Aehr Test SystemsFremont, CA, United StatesClear
- Aemulus Holdings BerhadPenang, MalaysiaCaution
- ASMPT Ltd.Hong Kong, Hong Kong SAR ChinaClear
- BE Semiconductor Industries (Besi)Duiven, NetherlandsClear
- Beijing Huafeng Test & Control TechnologyBeijing, ChinaBlocked
- Chroma ATE Inc.Taoyuan, TaiwanClear
- Cohu, Inc.Poway, CA, United StatesClear
- DIAS Automation (HK) Ltd.Hong Kong, Hong Kong SAR ChinaBlocked
- DISCO CorporationTokyo, JapanClear
- F&K Delvotec Bondtechnik GmbH (F&S Bondtec)Ottobrunn, GermanyClear