Chips · Equipment
Assembly & Test Equipment
Die/wire bonders, molding systems, and automated test equipment for the back end. ASMPT (HK/SG), Besi (NL), Kulicke & Soffa (SG/US); test: Advantest (JP), Teradyne (US).
Equipment for
The map, filtered to who makes this.
Who makes it, by country36 on the index
- Japan8
- United States6
- China6
- Malaysia4
- Germany3
- Hong Kong SAR China2
- Taiwan2
- Netherlands1
- South Korea1
- Singapore1
- and 2 more countries
By result
- CHIPS: Passed20
- CHIPS: Needs review9
- CHIPS: Failed7
- Not screened0
Results under CHIPS and export controls. What each result means
Where they are
Makers on the index
All 36 on the map →- ACCRETECH / Tokyo Seimitsu Co., Ltd.Tokyo, JapanCHIPS: Passed
- Advantest CorporationTokyo, JapanCHIPS: Passed
- Aehr Test SystemsFremont, CA, United StatesCHIPS: Passed
- Aemulus Holdings BerhadPenang, MalaysiaCHIPS: Needs review
- ASMPT Ltd.Hong Kong, Hong Kong SAR ChinaCHIPS: Passed
- BE Semiconductor Industries (Besi)Duiven, NetherlandsCHIPS: Passed
- Beijing Huafeng Test & Control TechnologyBeijing, ChinaCHIPS: Failed
- Chroma ATE Inc.Taoyuan, TaiwanCHIPS: Passed
- Cohu, Inc.Poway, CA, United StatesCHIPS: Passed
- DIAS Automation (HK) Ltd.Hong Kong, Hong Kong SAR ChinaCHIPS: Failed
- DISCO CorporationTokyo, JapanCHIPS: Passed
- F&K Delvotec Bondtechnik GmbH (F&S Bondtec)Ottobrunn, GermanyCHIPS: Passed