Semiconductors Supply Chain
Assembly & Test Equipment
Equipment (enabled-by)
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Semiconductors›Equipment (enabled-by)
Assembly & Test Equipment
Die/wire bonders, molding systems, and automated test equipment for the back end. ASMPT (HK/SG), Besi (NL), Kulicke & Soffa (SG/US); test: Advantest (JP), Teradyne (US).
Suppliers
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Equipment: enables these stages
Suppliers at this stage
View all 36 →ACCRETECH / Tokyo Seimitsu Co., Ltd.
Tokyo · JP · Dicing machines, wafer probing machines, back-end grinders (plus CMP and precision metrology)
Advantest Corporation
Tokyo · JP · Automated test equipment (ATE) for logic and memory
Aehr Test Systems
Fremont, CA · US · Wafer-level burn-in and test systems (FOX-XP, Sonoma) for SiC/GaN power and memory devices
Aemulus Holdings Berhad
Penang · MY · RF and mixed-signal automated test equipment (ATE) for semiconductor final test
ASMPT Ltd.
Hong Kong · HK · Die bonders, wire bonders, laser bonding, SMT placement
BE Semiconductor Industries (Besi)
Duiven · NL · Flip chip and thermocompression die bonding systems
Beijing Huafeng Test & Control Technology
Beijing · CN · Analog and mixed-signal ATE systems
Chroma ATE Inc.
Taoyuan · TW · Semiconductor automated test equipment (ATE), wafer probing solutions, AOI for advanced packaging
Cohu, Inc.
Poway, CA · US · Test handlers and automated test equipment
DIAS Automation (HK) Ltd.
Hong Kong · HK · Die sorters, die bonders, ultrasonic wire bonders, dispensing and inspection systems for IC and chip-on-board packaging
DISCO Corporation
Tokyo · JP · Dicing saws, laser saws, wafer grinders and polishers (back-end)
F&K Delvotec Bondtechnik GmbH (F&S Bondtec)
Ottobrunn · DE · Ultrasonic thin/thick wire and laser wire bonders for semiconductor, MEMS and power devices
FormFactor, Inc.
Livermore, California · US · Wafer probe cards, engineering probe stations and analytical probe systems for wafer sort/test
Guangli Keji (光力科技 / Glorylight)
Zhengzhou · CN · Wafer/die dicing saws
Hangzhou Changchuan Technology
Hangzhou · CN · Testers, handlers, probers, AOI equipment
Hanmi Semiconductor
Incheon · KR · Auto molding, sawing & placement, TC bonders (HBM packaging)
Hesse GmbH (Hesse Mechatronics)
Paderborn · DE · Fully automated wedge-wedge wire bonders (light and heavy wire) for semiconductor and power-module assembly
KAIJO Corporation
Tokyo · JP · Wire bonders for IC, discrete, wafer-level and laser packages; ultrasonic wafer cleaning systems
Kulicke & Soffa Industries
Fort Washington, PA (exec) / Singapore (incorporated) · SG · Wire bonding and advanced interconnect equipment
Mi Technovation Berhad (Mi Equipment)
Penang · MY · Wafer-level chip-scale packaging (WLCSP) die sorting, precision/laser bonding, final test handlers, vision inspection
Micro Point Pro Ltd (MPP)
Yokneam Illit · IL · Manual wire bonders, die-attach systems, probe heads, bond-shear/destructive test tools, precision packaging tools
Mycronic AB (MRSI Systems)
Täby · SE · High-precision die bonders (eutectic, epoxy, flip-chip) for photonics/advanced packaging
Naike Zhuangbei (耐科装备)
Dongguan · CN · Molding equipment (gate-trim/forming), plastic-extrusion-derived encapsulation systems
Nordson Corporation (ASYMTEK / DAGE brands)
Westlake · US · Fluid dispensing/jetting for advanced packaging (ASYMTEK) and bond-test/X-ray inspection systems (DAGE) for back-end packaging
Palomar Technologies
Carlsbad, CA · US · Die bonders, wire/wedge bonders, vacuum reflow systems
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