Company record
Hesse GmbH (Hesse Mechatronics)
Makes assembly & test equipment · Germany
Too little confirmed ownership data to clear it under the CHIPS rules: a gap in the data, not a finding against it.
Something could not be confirmed, often owners that are not public. About CHIPS
Legal name: Möbel Hesse GmbH
Where it sits
The Semiconductors chain, raw material to product
Products on record: Fully automated wedge-wedge wire bonders (light and heavy wire) for semiconductor and power-module assembly
Owners
- Parent
- None on record
- Ownership
- Private
Locations
- Headquarters
- Paderborn, Germany
- Production
- Paderborn, Germany
Sources
- Company registries
- 1 matched
- Registry identifier
- 391200S9TDS90RU9WV83
- Government lists
- None matched
Others making assembly & test equipmentGermany first
- F&K Delvotec Bondtechnik GmbH (F&S Bondtec)Ottobrunn, GermanyClear
- TPT Wire Bonder GmbH & Co. KGMunich, GermanyCaution
- ACCRETECH / Tokyo Seimitsu Co., Ltd.Tokyo, JapanClear
- Advantest CorporationTokyo, JapanClear
- Aehr Test SystemsFremont, CA, United StatesClear
- Aemulus Holdings BerhadPenang, MalaysiaCaution
- ASMPT Ltd.Hong Kong, Hong Kong SAR ChinaClear
- BE Semiconductor Industries (Besi)Duiven, NetherlandsClear
Automated results come from registry sources, read by fixed rules, with research findings where the registries stop. The chip results also read the US government lists; for FEOC the lists are read in a full screen. They are advisory, not legal advice. A reviewed report is written by a person on request. Contact us