Company record
TPT Wire Bonder GmbH & Co. KG
Makes assembly & test equipment · Germany
CautionCHIPS and export controls
Too little confirmed ownership data to clear it under the CHIPS rules: a gap in the data, not a finding against it.
Something could not be confirmed, often owners that are not public. About CHIPS
The check read Home country Owners US government lists
Where it sits
Loading the model
Not a part of the chip; a step on its chain
The Semiconductors chain, raw material to product
Products on record: Manual, semi-automatic and fully automatic wire/ribbon/stud-bump bonders
Owners
- Parent
- None on record
- Ownership
- Private
Locations
- Headquarters
- Munich, Germany
- Production
- Munich, Germany
Sources
- Company registries
- unresolved
- Government lists
- None matched
Others making assembly & test equipmentGermany first
- F&K Delvotec Bondtechnik GmbH (F&S Bondtec)Ottobrunn, GermanyClear
- Hesse GmbH (Hesse Mechatronics)Paderborn, GermanyCaution
- ACCRETECH / Tokyo Seimitsu Co., Ltd.Tokyo, JapanClear
- Advantest CorporationTokyo, JapanClear
- Aehr Test SystemsFremont, CA, United StatesClear
- Aemulus Holdings BerhadPenang, MalaysiaCaution
- ASMPT Ltd.Hong Kong, Hong Kong SAR ChinaClear
- BE Semiconductor Industries (Besi)Duiven, NetherlandsClear
Automated results come from registry sources, read by fixed rules, with research findings where the registries stop. The chip results also read the US government lists; for FEOC the lists are read in a full screen. They are advisory, not legal advice. A reviewed report is written by a person on request. Contact us