Company record
TPT Wire Bonder GmbH & Co. KG
Makes assembly & test equipment · Germany
Needs reviewCHIPS and export controls
Too little confirmed ownership data to clear it under the CHIPS rules: a gap in the data, not a finding against it.
Something needs a person to read it: the reason line says what. About CHIPS
The check read Home country Owners US government lists
Where it sits
Loading the model
Not a part of the chip; a step on its chain
The Semiconductors chain, raw material to product
Products on record: Manual, semi-automatic and fully automatic wire/ribbon/stud-bump bonders
Owners
- Parent
- None on record
- Ownership
- Private
Locations
- Headquarters
- Munich, Germany
- Production
- Munich, Germany
Sources
- Company registries
- unresolved
- Government lists
- None matched
Others making assembly & test equipmentGermany first
- F&K Delvotec Bondtechnik GmbH (F&S Bondtec)Ottobrunn, GermanyCHIPS: Passed
- Hesse GmbH (Hesse Mechatronics)Paderborn, GermanyCHIPS: Needs review
- ACCRETECH / Tokyo Seimitsu Co., Ltd.Tokyo, JapanCHIPS: Passed
- Advantest CorporationTokyo, JapanCHIPS: Passed
- Aehr Test SystemsFremont, CA, United StatesCHIPS: Passed
- Aemulus Holdings BerhadPenang, MalaysiaCHIPS: Needs review
- ASMPT Ltd.Hong Kong, Hong Kong SAR ChinaCHIPS: Passed
- BE Semiconductor Industries (Besi)Duiven, NetherlandsCHIPS: Passed
Automated results come from registry sources, read by fixed rules, with research findings where the registries stop. The chip results also read the US government lists; for FEOC the lists are read in a full screen. They are advisory, not legal advice. The full report, every test with its sources, is on request. Contact us