Best on a bigger screen

The interactive map needs room. Open verdex.app on a laptop or desktop.

Company Dossier

F&K Delvotec Bondtechnik GmbH (F&S Bondtec)

Ottobrunn · Germany

All companies
Semiconductor Manufacturing Equipment · Assembly & Test Equipment

F&K Delvotec Bondtechnik GmbH (F&S Bondtec)

F & K DELVOTEC Bondtechnik GmbH

Ottobrunn · Germany

CLEAR

F&K Delvotec Bondtechnik GmbH (F&S Bondtec) is a company in the semiconductor manufacturing equipment supply chain, operating in Assembly & Test Equipment, based in Ottobrunn, Germany. Its main product line is Ultrasonic thin/thick wire and laser wire bonders for semiconductor, MEMS and power devices.

FEOC Prescreen Verdict
confidence: research

No covered-nation ownership identified (structure: concentrated)

CHIPS / Export-Control Verdict
CLEAR

No covered-nation incorporation, no statutory-list membership, no covered-nation ownership signal in the screening record

Country
Germany
HQ City
Ottobrunn
Sector
Semiconductor Manufacturing Equipment
Category
Assembly & Test Equipment
Product Line
Ultrasonic thin/thick wire and laser wire bonders for semiconductor, MEMS and power devices
Production Locations
Ottobrunn Germany
LEI
529900D91LC5SP7QDJ71
Parent
Strama-MPS Maschinenbau (Strama Group)
Ownership Type
Private
Resolution
PARTIAL
Registries Matched
1
Data Quality
1.00

Need a deeper screen on this supplier?

Run the full FEOC pipeline (ownership trace, debt analysis, cert status), with audit trail.

Contact

Prescreen verdicts are deterministic ratings based on registry data (GLEIF, SEC EDGAR, OpenCorporates, Tianyancha) and statutory lists (CSL, OFAC, BIS, UFLPA, NDAA §154b). They are advisory, not legal advice.