Company record
F&K Delvotec Bondtechnik GmbH (F&S Bondtec)
Makes assembly & test equipment · Germany
Not incorporated in a country of concern, with no US government list entry and no owner from such a country in the screening record.
Not based in a covered nation and on no government list. About CHIPS
Legal name: F & K DELVOTEC Bondtechnik GmbH
Where it sits
The Semiconductors chain, raw material to product
Products on record: Ultrasonic thin/thick wire and laser wire bonders for semiconductor, MEMS and power devices
Owners
- Parent
- Strama-MPS Maschinenbau (Strama Group)
- Ownership
- Private
Locations
- Headquarters
- Ottobrunn, Germany
- Production
- Ottobrunn, Germany
Sources
- Company registries
- 1 matched
- Registry identifier
- 529900D91LC5SP7QDJ71
- Government lists
- None matched
Others making assembly & test equipmentGermany first
- Hesse GmbH (Hesse Mechatronics)Paderborn, GermanyCHIPS: Needs review
- TPT Wire Bonder GmbH & Co. KGMunich, GermanyCHIPS: Needs review
- ACCRETECH / Tokyo Seimitsu Co., Ltd.Tokyo, JapanCHIPS: Passed
- Advantest CorporationTokyo, JapanCHIPS: Passed
- Aehr Test SystemsFremont, CA, United StatesCHIPS: Passed
- Aemulus Holdings BerhadPenang, MalaysiaCHIPS: Needs review
- ASMPT Ltd.Hong Kong, Hong Kong SAR ChinaCHIPS: Passed
- BE Semiconductor Industries (Besi)Duiven, NetherlandsCHIPS: Passed
Automated results come from registry sources, read by fixed rules, with research findings where the registries stop. The chip results also read the US government lists; for FEOC the lists are read in a full screen. They are advisory, not legal advice. The full report, every test with its sources, is on request. Contact us