Suppliers
Companies
Browse prescreened suppliers by sector, stage, and verdict. Open any dossier for the full picture.
36 results
ACCRETECH / Tokyo Seimitsu Co., Ltd.
Dicing machines, wafer probing machines, back-end grinders (plus CMP and precision metrology)
Advantest Corporation
Automated test equipment (ATE) for logic and memory
Aehr Test Systems
Wafer-level burn-in and test systems (FOX-XP, Sonoma) for SiC/GaN power and memory devices
Aemulus Holdings Berhad
RF and mixed-signal automated test equipment (ATE) for semiconductor final test
ASMPT Ltd.
Die bonders, wire bonders, laser bonding, SMT placement
BE Semiconductor Industries (Besi)
Flip chip and thermocompression die bonding systems
Beijing Huafeng Test & Control Technology
Analog and mixed-signal ATE systems
Chroma ATE Inc.
Semiconductor automated test equipment (ATE), wafer probing solutions, AOI for advanced packaging
Cohu, Inc.
Test handlers and automated test equipment
DIAS Automation (HK) Ltd.
Die sorters, die bonders, ultrasonic wire bonders, dispensing and inspection systems for IC and chip-on-board packaging
DISCO Corporation
Dicing saws, laser saws, wafer grinders and polishers (back-end)
F&K Delvotec Bondtechnik GmbH (F&S Bondtec)
Ultrasonic thin/thick wire and laser wire bonders for semiconductor, MEMS and power devices
FormFactor, Inc.
Wafer probe cards, engineering probe stations and analytical probe systems for wafer sort/test
Guangli Keji (光力科技 / Glorylight)
Wafer/die dicing saws
Hangzhou Changchuan Technology
Testers, handlers, probers, AOI equipment
Hanmi Semiconductor
Auto molding, sawing & placement, TC bonders (HBM packaging)
Hesse GmbH (Hesse Mechatronics)
Fully automated wedge-wedge wire bonders (light and heavy wire) for semiconductor and power-module assembly
KAIJO Corporation
Wire bonders for IC, discrete, wafer-level and laser packages; ultrasonic wafer cleaning systems
Kulicke & Soffa Industries
Wire bonding and advanced interconnect equipment
Mi Technovation Berhad (Mi Equipment)
Wafer-level chip-scale packaging (WLCSP) die sorting, precision/laser bonding, final test handlers, vision inspection
Micro Point Pro Ltd (MPP)
Manual wire bonders, die-attach systems, probe heads, bond-shear/destructive test tools, precision packaging tools
Mycronic AB (MRSI Systems)
High-precision die bonders (eutectic, epoxy, flip-chip) for photonics/advanced packaging
Naike Zhuangbei (耐科装备)
Molding equipment (gate-trim/forming), plastic-extrusion-derived encapsulation systems
Nordson Corporation (ASYMTEK / DAGE brands)
Fluid dispensing/jetting for advanced packaging (ASYMTEK) and bond-test/X-ray inspection systems (DAGE) for back-end packaging
Palomar Technologies
Die bonders, wire/wedge bonders, vacuum reflow systems
Pentamaster Corporation Berhad
Automated test equipment (ATE) and factory automation systems for semiconductor back-end testing
Shibuya Corporation
Flip-chip die bonders, wire bonders, test handlers, taping machines
Shinkawa Ltd.
Wire, flip chip, and tab die bonding equipment
STAr Technologies, Inc.
Wafer-level parametric test systems, probe stations, probe cards
TBSTest Technology
Automated test equipment (ATE) for SoC, memory (T800, TM8000 series) and power semiconductors (TP series)
Teradyne
Automated test equipment (ATE), UltraFLEX/J750 platforms
Toray Engineering Co., Ltd.
Flip-chip and thermal-compression bonders (TCB) for advanced packaging incl. panel-level packaging (UC5000)
TOWA Corporation
Resin molding (transfer and compression) equipment, dicers/handlers
TPT Wire Bonder GmbH & Co. KG
Manual, semi-automatic and fully automatic wire/ribbon/stud-bump bonders
ViTrox Corporation Berhad
Automated optical/X-ray inspection (AOI/AXI) and test handlers for back-end semiconductor and OSAT processes
Xinyichang (新益昌)
Die/wire bonding equipment (incl. LED die bonders)