Best on a bigger screen

The interactive map needs room. Open verdex.app on a laptop or desktop.

Company Dossier

Toray Engineering Co., Ltd.

Otsu · Japan

All companies
Semiconductor · Assembly & Test Equipment

Toray Engineering Co., Ltd.

東レ株式会社

Otsu · Japan

CLEAR

Toray Engineering Co., Ltd. is a company in the semiconductor supply chain, operating in Assembly & Test Equipment, based in Otsu, Japan. Its main product line is Flip-chip and thermal-compression bonders (TCB) for advanced packaging incl. panel-level packaging (UC5000).

FEOC Prescreen Verdict
confidence: research

No covered-nation ownership identified (structure: concentrated)

CHIPS / Export-Control Verdict
CLEAR

No covered-nation incorporation, no statutory-list membership, no covered-nation ownership signal in the screening record

Country
Japan
HQ City
Otsu
Sector
Semiconductor
Category
Assembly & Test Equipment
Product Line
Flip-chip and thermal-compression bonders (TCB) for advanced packaging incl. panel-level packaging (UC5000)
Production Locations
Otsu Japan
LEI
35380099TCYR5FHT0A11
Parent
Toray Industries
Ownership Type
Subsidiary
Resolution
PARTIAL
Registries Matched
1
Data Quality
1.00

Need a deeper screen on this supplier?

Run the full FEOC pipeline (ownership trace, debt analysis, cert status), with audit trail.

Contact

Prescreen verdicts are deterministic ratings based on registry data (GLEIF, SEC EDGAR, OpenCorporates, Tianyancha) and statutory lists (CSL, OFAC, BIS, UFLPA, NDAA §154b). They are advisory, not legal advice.