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Company Dossier

Toray Engineering Co., Ltd.

Otsu · Japan

All companies
Semiconductor · Assembly & Test Equipment

Toray Engineering Co., Ltd.

東レ株式会社

Otsu · Japan

CLEAR

Toray Engineering Co., Ltd. is a company in the semiconductor supply chain, operating in Assembly & Test Equipment, based in Otsu, Japan. Verdex maps it across 1 stage of the supply chain, covering Flip-chip and thermal-compression bonders (TCB) for advanced packaging incl. panel-level packaging (UC5000).

CHIPS / Export-Control Verdict
CLEAR

No covered-nation incorporation, no statutory-list membership, no covered-nation ownership signal in the screening record

Country
Japan
HQ City
Otsu
Sector
Semiconductor
Category
Assembly & Test Equipment
Product Line
Flip-chip and thermal-compression bonders (TCB) for advanced packaging incl. panel-level packaging (UC5000)
Production Locations
Otsu Japan
LEI
35380099TCYR5FHT0A11
Parent
Toray Industries
Ownership Type
Subsidiary
Resolution
PARTIAL
Registries Matched
1
Data Quality
1.00

Supply chain placement

Semiconductors
Assembly & Test Equipment

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Prescreen verdicts are deterministic ratings based on registry data (GLEIF, SEC EDGAR, OpenCorporates, Tianyancha) and statutory lists (CSL, OFAC, BIS, UFLPA, NDAA §154b). They are advisory, not legal advice.