Company Dossier
DISCO Corporation
Tokyo · Japan
All companiesCLEARContact
Semiconductor · Assembly & Test Equipment
DISCO Corporation
株式会社ディスコ
Tokyo · Japan
DISCO Corporation is a company in the semiconductor supply chain, operating in Assembly & Test Equipment, based in Tokyo, Japan. Its main product line is Dicing saws, laser saws, wafer grinders and polishers (back-end).
FEOC Prescreen Verdict
confidence: deterministic
Widely-held public entity — no concentrated holder signal from registry data
CHIPS / Export-Control Verdict
CLEAR
No covered-nation incorporation, no statutory-list membership, no covered-nation ownership signal in the screening record
Country
Japan
HQ City
Tokyo
Sector
Semiconductor
Category
Assembly & Test Equipment
Product Line
Dicing saws, laser saws, wafer grinders and polishers (back-end)
Production Locations
Tokyo Japan; Nagano Japan
LEI
529900X0YGDYM51H4Q86
Ownership Type
Public
Resolution
PARTIAL
Registries Matched
1
Data Quality
0.89
Need a deeper screen on this supplier?
Run the full FEOC pipeline (ownership trace, debt analysis, cert status), with audit trail.
Prescreen verdicts are deterministic ratings based on registry data (GLEIF, SEC EDGAR, OpenCorporates, Tianyancha) and statutory lists (CSL, OFAC, BIS, UFLPA, NDAA §154b). They are advisory, not legal advice.