Part of the chip
Leadframe and wire
The metal frame and bonding wire that connect the die outward.
The step: Leadframes & Bonding Wire · Packaging Materials
Stamped/etched metal leadframes and fine gold/copper/silver bonding wire for wire-bonded packages. Wire: Heraeus (DE), Tanaka (JP), Sumitomo MM (JP), MK Electron (KR); leadframes: Mitsui High-tec (JP), Shinko (JP).
Goes into
The map, filtered to who makes this.
Loading the model
The chip, with the leadframe and wire lit
Who makes it, by country16 on the index
- Japan6
- South Korea3
- China2
- Hong Kong SAR China1
- United States1
- Taiwan1
- Germany1
- Canada1
By result
- CHIPS: Passed10
- CHIPS: Needs review4
- CHIPS: Failed2
- Not screened0
Results under CHIPS and export controls. What each result means
Where they are
Makers on the index
All 16 on the map →- Advanced Assembly Materials International (AAMI)Hong Kong, Hong Kong SAR ChinaCHIPS: Passed
- AMETEK (California Fine Wire)Berwyn, PA (parent); Grover Beach, CA (subsidiary), United StatesCHIPS: Passed
- Chang Wah Technology (CWTC)Kaohsiung, TaiwanCHIPS: Needs review
- Haesung DSAnsan, South KoreaCHIPS: Needs review
- Heraeus Holding GmbHHanau, GermanyCHIPS: Passed
- Microbonds Inc.Markham, Ontario, CanadaCHIPS: Needs review
- Mitsui High-tecKitakyushu, JapanCHIPS: Passed
- MK ElectronYongin, South KoreaCHIPS: Passed
- Nippon MicrometalOsaka, JapanCHIPS: Needs review
- QPL Limited (QPL Electronics Factory)Hong Kong, ChinaCHIPS: Failed
- SDI GroupUnknown, South KoreaCHIPS: Passed
- Shinko Electric IndustriesNagano, JapanCHIPS: Passed