Verdex

Part of the chip

Leadframe and wire

The metal frame and bonding wire that connect the die outward.

The step: Leadframes & Bonding Wire · Packaging Materials

Stamped/etched metal leadframes and fine gold/copper/silver bonding wire for wire-bonded packages. Wire: Heraeus (DE), Tanaka (JP), Sumitomo MM (JP), MK Electron (KR); leadframes: Mitsui High-tec (JP), Shinko (JP).

Open on the map How a chip is made

The map, filtered to who makes this.

Loading the model

The chip, with the leadframe and wire lit

Who makes it, by country16 on the index

  1. Japan6
  2. South Korea3
  3. China2
  4. Hong Kong SAR China1
  5. United States1
  6. Taiwan1
  7. Germany1
  8. Canada1

By result

  • Clear10
  • Caution4
  • Flagged0
  • Blocked2
  • Not screened0

Results under CHIPS and export controls. What each result means

Where they are

6

Makers on the index

All 16 on the map →