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Semiconductors Supply Chain

Leadframes & Bonding Wire

Packaging Materials

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SemiconductorsPackaging Materials

Leadframes & Bonding Wire

Stamped/etched metal leadframes and fine gold/copper/silver bonding wire for wire-bonded packages. Wire: Heraeus (DE), Tanaka (JP), Sumitomo MM (JP), MK Electron (KR); leadframes: Mitsui High-tec (JP), Shinko (JP). Weakest-sourced branch of the draft; Step 2 company search will firm it up.

Suppliers
16
CLEAR
11
CAUTION
3
FLAGGED
0
BLOCKED
2

Process flow

Upstream inputs

None: first stage.

Downstream outputs

Suppliers at this stage

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