Company record
Oita Device Technology Co., Ltd. (ODT / 大分デバイステクノロジー)
Makes packaged chip · Japan
Needs reviewCHIPS and export controls
Too little confirmed ownership data to clear it under the CHIPS rules: a gap in the data, not a finding against it.
Something needs a person to read it: the reason line says what. About CHIPS
The check read Home country Owners US government lists
Legal name: DEVICE
Where it sits
Loading the model
Packaged chip
The Semiconductors chain, raw material to product
Products on record: OSAT specialized in power devices/modules — SiC/GaN power module packaging, design-through-volume-production
Owners
- Parent
- None on record
- Ownership
- Private
Locations
- Headquarters
- Oita, Japan
- Production
- Oita, Japan
Sources
- Company registries
- 1 matched
- Registry identifier
- 894500HHL1FHII9GFL61
- Government lists
- None matched
Others making packaged chipJapan first
- Aoi Electronics Co., Ltd. (アオイ電子)Takamatsu, JapanCHIPS: Passed
- Shinko Electric IndustriesNagano, JapanCHIPS: Passed
- Amkor TechnologyTempe, Arizona, United StatesCHIPS: Passed
- ASE Technology Holding (incl. SPIL)Kaohsiung, TaiwanCHIPS: Passed
- Carsem (Malaysian Pacific Industries / MPI)Ipoh, MalaysiaCHIPS: Passed
- CG Power and Industrial Solutions (OSAT)Mumbai (facility: Sanand, Gujarat), IndiaCHIPS: Passed
- China Wafer Level CSP (晶方科技)Suzhou, ChinaCHIPS: Failed
- Chipbond Technology CorporationHsinchu, TaiwanCHIPS: Passed
Automated results come from registry sources, read by fixed rules, with research findings where the registries stop. The chip results also read the US government lists; for FEOC the lists are read in a full screen. They are advisory, not legal advice. The full report, every test with its sources, is on request. Contact us