Company record
Nepes Corporation
Makes packaged chip · South Korea
Needs reviewCHIPS and export controls
Too little confirmed ownership data to clear it under the CHIPS rules: a gap in the data, not a finding against it.
Something needs a person to read it: the reason line says what. About CHIPS
The check read Home country Owners US government lists
Where it sits
Loading the model
Packaged chip
The Semiconductors chain, raw material to product
Products on record: OSAT: fan-out wafer-level and panel-level packaging (FOWLP/FOPLP), bumping
Owners
- Parent
- None on record
- Ownership
- Public
Locations
- Headquarters
- Seoul, South Korea
- Production
- Seoul, South Korea
- Cheonan, South Korea
Sources
- Company registries
- unresolved
- Government lists
- None matched
Others making packaged chipSouth Korea first
- Hana MicronBucheon, South KoreaCHIPS: Passed
- LB Semicon Inc.Cheongju, South KoreaCHIPS: Passed
- Samsung Electronics (Samsung Foundry)Suwon, South KoreaCHIPS: Passed
- SFA SemiconBucheon, South KoreaCHIPS: Passed
- Signetics KoreaBucheon, South KoreaCHIPS: Needs review
- Amkor TechnologyTempe, Arizona, United StatesCHIPS: Passed
- Aoi Electronics Co., Ltd. (アオイ電子)Takamatsu, JapanCHIPS: Passed
- ASE Technology Holding (incl. SPIL)Kaohsiung, TaiwanCHIPS: Passed
Automated results come from registry sources, read by fixed rules, with research findings where the registries stop. The chip results also read the US government lists; for FEOC the lists are read in a full screen. They are advisory, not legal advice. The full report, every test with its sources, is on request. Contact us