Company record
UTAC Group (United Test and Assembly Center)
Makes packaged chip · Singapore
Needs reviewCHIPS and export controls
Too little confirmed ownership data to clear it under the CHIPS rules: a gap in the data, not a finding against it.
Something needs a person to read it: the reason line says what. About CHIPS
The check read Home country Owners US government lists
Legal name: UTAC GROUP
Where it sits
Loading the model
Packaged chip
The Semiconductors chain, raw material to product
Products on record: OSAT: leadframe, laminate, WLP, SiP for automotive/analog
Owners
- Parent
- WiseRoad Capital
- Ownership
- Private
Locations
- Headquarters
- Singapore, Singapore
- Production
- Singapore
- Bangkok, Thailand
- Batam, Indonesia
- Chengdu, China
- Ipoh, Malaysia
Sources
- Company registries
- 1 matched
- Registry identifier
- 894500I0UFL02B07TA38
- Government lists
- None matched
Others making packaged chipSingapore first
- Amkor TechnologyTempe, Arizona, United StatesCHIPS: Passed
- Aoi Electronics Co., Ltd. (アオイ電子)Takamatsu, JapanCHIPS: Passed
- ASE Technology Holding (incl. SPIL)Kaohsiung, TaiwanCHIPS: Passed
- Carsem (Malaysian Pacific Industries / MPI)Ipoh, MalaysiaCHIPS: Passed
- CG Power and Industrial Solutions (OSAT)Mumbai (facility: Sanand, Gujarat), IndiaCHIPS: Passed
- China Wafer Level CSP (晶方科技)Suzhou, ChinaCHIPS: Failed
- Chipbond Technology CorporationHsinchu, TaiwanCHIPS: Passed
- ChipMOS TechnologiesHsinchu, TaiwanCHIPS: Needs review
Automated results come from registry sources, read by fixed rules, with research findings where the registries stop. The chip results also read the US government lists; for FEOC the lists are read in a full screen. They are advisory, not legal advice. The full report, every test with its sources, is on request. Contact us