Company record
UTAC Group (United Test and Assembly Center)
Makes packaged chip · Singapore
CautionCHIPS and export controls
Too little confirmed ownership data to clear it under the CHIPS rules: a gap in the data, not a finding against it.
Something could not be confirmed, often owners that are not public. About CHIPS
The check read Home country Owners US government lists
Legal name: UTAC GROUP
Where it sits
Loading the model
Packaged chip
The Semiconductors chain, raw material to product
Products on record: OSAT: leadframe, laminate, WLP, SiP for automotive/analog
Owners
- Parent
- WiseRoad Capital
- Ownership
- Private
Locations
- Headquarters
- Singapore, Singapore
- Production
- Singapore
- Bangkok, Thailand
- Batam, Indonesia
- Chengdu, China
- Ipoh, Malaysia
Sources
- Company registries
- 1 matched
- Registry identifier
- 894500I0UFL02B07TA38
- Government lists
- None matched
Others making packaged chipSingapore first
- Amkor TechnologyTempe, Arizona, United StatesClear
- Aoi Electronics Co., Ltd. (アオイ電子)Takamatsu, JapanClear
- ASE Technology Holding (incl. SPIL)Kaohsiung, TaiwanClear
- Carsem (Malaysian Pacific Industries / MPI)Ipoh, MalaysiaClear
- CG Power and Industrial Solutions (OSAT)Mumbai (facility: Sanand, Gujarat), IndiaClear
- China Wafer Level CSP (晶方科技)Suzhou, ChinaBlocked
- Chipbond Technology CorporationHsinchu, TaiwanClear
- ChipMOS TechnologiesHsinchu, TaiwanCaution
Automated results come from registry sources, read by fixed rules, with research findings where the registries stop. The chip results also read the US government lists; for FEOC the lists are read in a full screen. They are advisory, not legal advice. A reviewed report is written by a person on request. Contact us