Company record
YSemi (甬矽电子, Ningbo Forehope Electronic)
Makes packaged chip · China
Incorporated in China, which makes it a foreign entity of concern under the CHIPS rules (15 CFR 231.104).
Based in a country of concern, owned from one, or on a government list. About CHIPS
Legal name: Yongsi Electronics (Ningbo) Co., Ltd.
Where it sits
The Semiconductors chain, raw material to product
Products on record: Mid-to-high-end IC packaging/test: QFN/DFN, WBLGA, FCBGA, Fan-in/Fan-out WLCSP, 2.5D/3D packaging
Owners
- Parent
- None on record
- Ownership
- Public
Locations
- Headquarters
- Ningbo, China
- Production
- Yuyao Ningbo, China
Sources
- Company registries
- 1 matched
- Government lists
- None matched
Others making packaged chipChina first
- China Wafer Level CSP (晶方科技)Suzhou, ChinaBlocked
- Hefei Chipmore Technology (Chipmore/颀中科技)Hefei, ChinaBlocked
- HuaCheng Technology (汇成股份)Hefei, ChinaBlocked
- JCET GroupJiangyin, ChinaBlocked
- Liyang Chip Testing / Guangdong Liyang Chip Testing (利扬芯片)Guangzhou, ChinaBlocked
- QP Technology (气派科技)Dongguan, ChinaBlocked
- Sino IC Technology / Shanghai Huailing (华岭股份)Shanghai, ChinaBlocked
- SJ Semiconductor (SJSemi / 盛合晶微半导体)Jiangyin, ChinaBlocked
Automated results come from registry sources, read by fixed rules, with research findings where the registries stop. The chip results also read the US government lists; for FEOC the lists are read in a full screen. They are advisory, not legal advice. A reviewed report is written by a person on request. Contact us